Microelectronics

Flip Chip and Thermal Test Die

Delphi leverages its experience with the automotive industry to design, produce, test, and deliver electronic systems that create the greatest value for our customers. Our Microelectronics Center has developed the engineering expertise to provide IC solutions focused on market demands - smaller, thinner, lighter, lower cost, higher power/current and greater reliability.

Delphi uses test chips to facilitate the development of innovative, cost-effective IC packages, flip chip bumping processes, and flip chip board-level assembly processes. With more than 30 years of flip chip experience, an evolution of test chips has grown into today's set of test die, while thermal test die have been developed to characterize thermal performance and power dissipation of both flip chips and IC packages.

Designed for experimental work to improve the reliability, yield, materials set, and time-to-market of IC systems, both flip chip and thermal test die can be ordered by e-mail, fax or by mail.

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