Microelectronics

The Delphi FA (Full Array) series of test die is designed to simulate the I/O of CMOS-like devices at various pad pitches. These test vehicles form the basis of a useful die standard for the evaluation of flip chip applications as a function of various bump, materials, or assembly variables. A limited subset of FA series die have been designed for wire bond evaluations. See "options available" for availability of wire bond compatible die.

The FA08 test chip is designed with I/O pads on 8 mil (204 micron) pitch located on the peripheral of the die. The 0.2-inch by 0.2-inch FA08 die contains 569 pads giving 284 daisy chain pairs.

IC Fab Information

Die Sizes Available

• .200" x .200"
• .400" x .400"
• .400" x .600"

Options Available

1) Five-inch wafer, no bumps, nitride passivation, 55-micron circular passivation openings (diagram 1)
2) Five-inch wafer, bumped, 63Sn/37Pb solder, UBM diameter 89 microns, bump height 95 microns (diagram 1)