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Flip Chip and Thermal Test Die
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Delphi FBT 250 Test Die
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The Delphi FBT250 test chip is designed with I/O pads on 18 mil (457.2 micron) pitch located on the peripheral of the die. The 0.5-inch by 0.25-inch FBT250 die contains 48 pads giving 24 daisy chain pairs.
IC Fab Information
| 5-inch (125 mm) | |
| 600-650 microns | |
| 17k angstroms | |
| Al/Cu/Si (98/1/1) | |
| 10k angstroms | |
| Nitride |
Die Sizes Available
- .25” x .25”
Options Available
- Five-inch wafer, no bumps, nitride passivation, 102-micron circular passivation openings (diagram 1)
- Five-inch wafer, FOC bump, 63Sn/37Pb solder, UBM diameter – 178 microns, bump height – 140 microns (diagram 3)
- Five-inch wafer, FOC bump, In/Pb high-temperature solder, UBM diameter – 178 microns, bump height – 140 microns (diagram 3)
- Five-inch wafer, FOC bump, In/Pb low-temperature solder, UBM diameter – 178 microns, bump height – 140 microns (diagram 3)
- Five-inch wafer, FOC bump, 10Sn/90Pb solder, UBM diameter – 178 microns, bump height – 140 microns (diagram 3)
The test die offered on this web site are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.