Microelectronics

The Delphi PB (Perimeter Bump or Bond) series of test die is designed to simulate the I/O of CMOS-like devices at various pad pitches. These test vehicles form the basis of a useful die standard for the evaluation of flip chip applications as a function of various bump, materials, or assembly variables. A limited subset of PB series die have been designed for wire bond evaluations. See "options available" for availability of wire bond compatible die.

The PB10 test chip is designed with I/O pads on 10 mil (254 micron) pitch located on the peripheral of the die. The 0.2-inch by 0.2-inch PB10 die contains 64 pads giving 32 daisy chain pairs.

IC Fab Information

Die Sizes Available

• .200" x .200"
• .400" x .400"
• .400" x .600"
• .800" x .800"

Options Available

1) Five-inch wafer, no bumps, nitride passivation, 95-micron circular passivation openings (diagram 1)
2) Five-inch wafer, no bumps, nitride passivation and polyimide final passivation, 90-micron circular passivation openings (diagram 2)
3) Five-inch wafer, no bumps, nitride passivation, 118-micron circular passivation openings (diagram 3)
4) Five-inch wafer, no bumps, nitride passivation, 150-micron circular passivation openings (diagram 4)
5) Five-inch wafer, FOC bump, 63Sn/37Pb solder, UBM diameter 120 microns, bump height 130 microns (diagram 5)
6) Five-inch wafer, FOC bump, In/Pb high-temperature solder, UBM diameter 120 microns, bump height 130 microns (diagram 5)
7) Five-inch wafer, FOC bump, In/Pb low-temperature solder, UBM diameter 120 microns, bump height 130 microns (diagram 5)
8) Five-inch wafer, FOC bump, lead free-2 solder, UBM diameter 120 microns, bump height 132 microns (diagram 5)
9) Five-inch wafer, FOC bump, 10Sn/90Pb solder, UBM diameter 120 microns, bump height 127 microns (diagram 5)
10) Five-inch wafer, FOC bump, 63Sn/37Pb solder, UBM diameter 152 microns, bump height 132 microns (diagram 6)
11) Five-inch wafer, FOC bump, In/Pb high-temperature solder, UBM diameter 152 microns, bump height 132 microns (diagram 6)
12) Five-inch wafer, FOC bump, In/Pb low-temperature solder, UBM diameter 152 microns, bump height 132 microns (diagram 6)
13) Five-inch wafer, FOC bump, lead free-2 solder, UBM diameter 152 microns, bump height 132 microns (diagram 6)
14) Five-inch wafer, FOC bump, 10Sn/90Pb solder, UBM diameter 152 microns, bump height 127 microns (diagram 6)
15) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, 63Sn/37Pb solder, UBM diameter 120 microns, bump height 130 microns (diagram 7), engineering samples only
16) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, In/Pb high-temperature solder, UBM diameter 120 microns, bump height 130 microns (diagram 7), engineering samples only
17) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, In/Pb low-temperature solder, UBM diameter 120 microns, bump height 130 microns (diagram 7), engineering samples only
18) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, lead free-2 solder, UBM diameter 120 microns, bump height 130 microns (diagram 7), engineering samples only
19) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, 10Sn/90Pb solder, UBM diameter 120 microns, bump height 127 microns (diagram 7), engineering samples only
20) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, 63Sn/37Pb solder, UBM diameter 152 microns, bump height 132 microns (diagram 8), engineering samples only
21) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, In/Pb high temperature solder, UBM diameter 152 microns, bump height 132 microns (diagram 8), engineering samples only
22) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, In/Pb low-temperature solder, UBM diameter 152 microns, bump height 132 microns (diagram 8), engineering samples only
23) Five-inch wafer, FOC bump, nitride passivation and polyimide final passivation, lead free-2 solder, UBM diameter 152 microns, bump height 132 microns (diagram 8), engineering samples only

The test die offered on this web site are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.