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Microelectronics
Flip Chip and Thermal Test Die
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PB6 Test Die
The Delphi PB (Perimeter Bump or Bond) series of test die is designed The PB (Perimeter Bump or Bond) series of test die is designed to simulate the I/O of CMOS-like devices at various pad pitches. These test vehicles form the basis of a useful die standard for the evaluation of flip chip applications as a function of various bump, materials, or assembly variables. A limited subset of PB series die have been designed for wire bond evaluations. See "options available" for availability of wire bond compatible die.
The PB6 test chip is designed with I/O pads on 6 mil (152 micron) pitch located on the peripheral of the die. The 0.2-inch by 0.2-inch PB6 die contains 112 pads giving 56 daisy chain pairs.
IC Fab Information
| 5-inch (125 mm) | |
| 600-650 microns | |
| 8.9k angstroms | |
| Al/Cu/Si (98/1/1) | |
| 8k angstroms | |
| Nitride |
Die Sizes Available
- .200" x .200"
- .400" x .400"
- .400" x .600"
Options Available
1) Five-inch wafer, no bumps, nitride passivation, 55-micron circular passivation openings for wire bonding (diagram 1)
2) Five-inch wafer, no bumps, nitride passivation, 86-micron circular passivation openings (diagram 2)
3) Five-inch wafer, no bumps, nitride passivation and polyimide final passivation, 50-micron circular passivation openings (diagram 3)
4) Five-inch wafer, no bumps, nitride passivation, 105-micron square passivation openings for wire bonding (diagram 4)
5) Five-inch wafer, FOC bump, 63Sn/37Pb solder, UBM diameter 88 microns, bump height 85 microns (diagram 5)
6) Five-inch wafer, FOC bump, 10Sn/90Pb solder, UBM diameter 88 microns, bump height 80 microns (diagram 5), engineering samples only
7) Five-inch wafer, FOC bump, lead free-2 solder, UBM diameter 88 microns, bump height 85 microns (diagram 5), engineering samples only
8) Five-inch wafer, nitride passivation and polyimide final passivation, FOC bump, 63Sn/37Pb solder, UBM diameter 88 microns, bump height 85 microns (diagram 6)
9) Five-inch wafer, nitride passivation and polyimide final passivation, FOC bump, 10Sn/90Pb solder, UBM diameter 88 microns, bump height 80 microns (diagram 6), engineering samples only
10) Five-inch wafer, nitride passivation and polyimide final passivation, FOC bump, lead free-2 solder, UBM diameter 88 microns, bump height 85 microns (diagram 6), engineering samples only
