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Flip Chip and Thermal Test Die
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Delphi Temp01 Thermal Test Die
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The Delphi Temp01 thermal test die is the smallest thermal test die (.054 x .055). This thermal test die has a heating element for power dissipation purposes and a three-leg bridge network for temperature monitoring purposes.
The three legs of the bridge network allow the user to select what area on the die to use for temperature monitoring or all three can be selected individually with the proper test setup. If single diode temperature monitoring is desired, it can be achieved by utilizing any one of the diodes in between the Vx and Sx pins.
IC FAB Information
| 5-inch (125 mm) | |
| 610-650 microns | |
| 17k angstroms | |
| Al/Cu/Si (98/1/1) | |
| 10k angstroms | |
| Nitride |
|
Temp01 / X,Y Coordinates .054-Inch X .055-Inch Die Sizes (0,0) is located at the center of the die |
|||
| Microns | |||
| PIN # | NAME | X | Y |
| 1 | V(3) | 495.250 | 228.500 |
| 2 | R | -495.250 | 508.000 |
| 3 | V(2) | -495.258 | 254.000 |
| 4 | S(1) | -495.250 | -317.500 |
| 5 | V(1) | -495.250 | -508.000 |
| 6 | R | 203.250 | -508.000 |
| 7 | G | 495.250 | -482.500 |
| 8 | S(2) | 495.250 | 38.000 |
The test die offered on this web site is to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended.