Microelectronics

Flip Chip and Thermal Test Die

To place an order, please contact Delphi Electronics and Safety by e-mail, fax or mail.

Fax: [1] 765.451.8206
E-mail: terri.l.rupert@delphi.com@delphi.com
Mail:
Delphi Electronics and Safety
M/S FAB C
PO Box 9005
Kokomo, IN 46904-9005

Orders valued at $10,000 or less must be pre-paid (cash in advance). Orders valued more than $10,000 can also be secured with approved credit.

To obtain credit approval, please provide the following information via fax, mail or e-mail:

1. Your company's DUNS number
2. Three credit references

When making a cash-in-advance order, please cross-reference the purchase order number on the remittance and remittance information on the purchase order.

To make payment by Wire Transfer, contact Terri Rupert.

To make payment by Check, remit payment in US dollars to:

Delphi Electronics and Safety
c/o Bank One N. A.
P.O. Box 93268
Chicago, Illinois 60673

Shipment
All products will be shipped FOB Kokomo, Indiana. Freight charges are the responsibility of the purchaser.

After all conditions of sale are met, in-stock products will be shipped within two (2) weeks of receipt of the order. Products requiring manufacture will be shipped within thirteen (13) weeks of receipt of an approved purchase order.

Please Note: The test die offered on this web site are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.