Connectors

Delphi Bump Flex Assemblies are found in a wide array of markets from military to medical, and aerospace to automotive. Millions of Delphi flex circuits are currently in the field supporting high performance environments and meeting market needs for higher speed and greater density.

Since 1976, Delphi has been a major supplier of flex-based connection systems for the military—longer than any other flex manufacturer. Delphi is the sole supplier for several major military programs, including applications such as the F-15 radar system, the Sikorsky Blackhawk helicopter, and the M-1 tank.

Plated up bump technology is used to simplify interconnects between printed circuit boards (PCBs).  Several board-to-board interconnect configurations are available along with a wide range of customized options.

Delphi has the unique capability to provide turnkey interconnect services—from design and development, to manufacturing, assembly and in-house testing. Delphi can deliver complete enclosed assemblies, ready to plug into systems or ship individual components on-time per customer specifications.

Benefits/Features

• Plated, 3 dimensional, Z axis pressure point contacts as an integral feature to a flex circuit
• Flex circuit increases packaging options
• Blind mate and low insertion force
• Solderless connections

Typical Applications

• Radar systems
• Smart weapons
• Missiles
• Engine control modules
• Test equipment

Performance Characteristics

• Speeds up to 10 Gbps
• High density—up to 175 contacts per square inch
• High reliability in harsh environments
• Plating finishes tailored to customer specifications

The performance characteristics above are for reference only and may not account for all the variables that would be present in an actual application. For detailed product performance information, contact Delphi.