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Jun 27, 2008
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Flip Chip and Thermal Test Die
Designed for experimental work to improve the reliability, yield, materials set, and time-to-market of IC systems, both flip chip and thermal test die can be ordered by e-mail, fax or mail. Please Note: The test die offered on this web site are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.
| Thermal Test Die | ||
| Device | Die Size | Number of Die/Wafer |
| Temp01 | .054" x .055" | 6500 |
| PST1-02 | .100" x .100" | 1572 |
| PST2-03 | .150" x .150" | 682 |
| PST3-02 | .200" x .200" | 377 |
| PST4-02 | .250" x .250" | 238 |
| PST5-03 | .306" x .306" | 157 |
| PST6-02 | .400" x .400" | 80 |
| Metal-Up, Daisy Chain Test Die | |
| PB4 | Perimeter 4-mil pitch test die, bump and wire bondable configurations |
| PB6 | Perimeter 6-mil pitch test die, bump and wire bondable configurations |
| PB8 | Perimeter 8-mil pitch test die, bump and wire bondable configurations |
| PB10 | Perimeter 10-mil pitch test die, bump and wire bondable configurations |
| FA06 | Full array 6-mil pitch test die, bump configuration only, passivation openings 45 microns-circular |
| FA08 | Full array 8-mil pitch test die, bump configuration only, passivation openings 55 microns-circular |
| FA10 | Full array 10-mil pitch test die, bump and wire bondable configurations, passivation openings 80 and 100 microns-circular |
| FBT250 | Perimeter 18-mil pitch test die, bump configurations, die size .250" x .250" |
| FBT500 | Perimeter 18-mil pitch test die, bump configurations, die size .500" x .500" |
Please Note: The test die offered on this website are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchanability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.