Microelectronics

Flip Chip and Thermal Test Die

For technical and order information, contact:

Terri Rupert
Delphi Electronics and Safety
MS FAB C
P.O. Box 9005
Kokomo, Indiana 46904-9005
USA

E-mail: terri.l.rupert@delphi.com
Phone: [1] 765.451.8297
Fax: [1] 765.451.8206

Please Note: The test die offered on this web site are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.