Microelectronics

SAE Technical Papers: Review and download Delphi SAE Technical Papers

Flip Chip and Thermal Test Die

All test die are delivered on five-inch wafers, and only whole wafers can be purchased. Die are available in tape and reel packaging or wafer form. Waffle packs are also available.

Die size must be specified for Metal Up, Daisy Chain Test Die. Die sizes available for PBs and FAs are .2-inch x .2-inch, .4-inch x .4-inch, .4-inch x .6-inch, and .6-inch x .6-inch.

Temp/PST Test Die
Unbumped/wire bond version	$2750.00 each
UBM/Bumped wafer/PST1, PST2, PST4 only (standard solders** only)	$3000.00 each
Metal Up, Daisy Chain Test Die
Unbumped wafer	$350.00 each
UBM/Bumped wafer (standard solders** only)	$800.00 each
Quartz Test Die (non-daisy chained)
UBM/Bumped wafer (std solders only)	$1700.00 each
Additional Options
Solders: 10Sn/90Pb	$750.00 per order
Sn/3.5Ag/Cu (lead free-2) (eutectic)	$750.00 per order
Sawn in waffle pack	$100.00 per wafer
Sawn on tape/reel	$300.00 per wafer
Backside metal	$100.00 per wafer
Wafer thinning	$100.00 per wafer
.800 x .800 Die (sold in pieces only) Option prices still apply on per wafer/order basis Not available in tape and reel
Standard bumped	$75.00 per piece
Unbumped	$25.00 per piece

**Standard solders are 63Sn/37Pb (Eutectic), 50In/50Pb, 37In/63Pb/.4Ag and 61.5Sn/36Pb/2.5Cu (Enhanced Eutectic).

Note: All prices are in $US and are subject to change without notice.

Please Note: The test die offered on this web site are to be used to characterize assembly processes and materials. Applying the data from the test die to a functional system is the responsibility of the user. Delphi makes no warranty, express or implied including the implied warranties of merchantability and fitness for a particular purpose, that the user's system designed using that data will perform as intended by the user.